SMTS Physical Design Engineer
3 days ago
Bengaluru, Karnataka, India
LeadSoc Technologies Pvt Ltd
Full-time
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SMTS Physical Design Engineer
Location:
Bengaluru, India
Experience:
5–10 Years Technology Nodes: TSMC 3nm / 2nm EDA Tool: Cadence Innovus Role Overview We are seeking a highly skilled SMTS Physical Design Engineer with strong expertise in physical design sign-off and advanced-node implementation. The ideal candidate will have hands-on experience with Cadence Innovus and TSMC 3nm/2nm technologies, driving block-level implementation, optimization, and sign-off closure.
Key Responsibilities
• Execute physical design sign-off activities for complex design blocks.
• Drive block-level implementation and closure using Cadence Innovus.
• Perform timing optimization, congestion analysis, and physical design debugging.
• Resolve setup/hold violations and physical implementation issues to achieve sign-off readiness.
• Analyze and address DRC and other implementation violations in coordination with relevant teams.
• Collaborate with STA, synthesis, RTL, and physical verification teams to ensure design quality.
• Support PPA optimization and closure in advanced FinFET technology nodes.
• Ensure adherence to sign-off requirements, design constraints, and project schedules. Required Skills
• 5–10 years of hands-on experience in Physical Design.
• Strong expertise in physical design sign-off and block-level implementation.
• Proven experience with Cadence Innovus.
• Hands-on exposure to TSMC 3nm and/or 2nm process technologies.
• Strong understanding of timing closure, setup/hold analysis, and physical optimization.
• Experience with congestion management, design-rule debugging, and sign-off readiness.
• Solid understanding of advanced-node physical design methodologies and PPA trade-offs. Preferred Qualifications
• Experience with advanced FinFET implementation challenges at 3nm/2nm.
• Exposure to sign-off STA and physical verification flows.
• Strong problem-solving skills and cross-functional collaboration experience. Education B.
E./B.
Tech/M.
E./M.
Tech in Electronics, Electrical Engineering, VLSI, or a related discipline. Ideal Candidate: A hands-on Physical Design Engineer with strong Innovus proficiency, proven sign-off execution experience, and practical exposure to TSMC 3nm/2nm technologies.
Location:
Bengaluru, India
Experience:
5–10 Years Technology Nodes: TSMC 3nm / 2nm EDA Tool: Cadence Innovus Role Overview We are seeking a highly skilled SMTS Physical Design Engineer with strong expertise in physical design sign-off and advanced-node implementation. The ideal candidate will have hands-on experience with Cadence Innovus and TSMC 3nm/2nm technologies, driving block-level implementation, optimization, and sign-off closure.
Key Responsibilities
• Execute physical design sign-off activities for complex design blocks.
• Drive block-level implementation and closure using Cadence Innovus.
• Perform timing optimization, congestion analysis, and physical design debugging.
• Resolve setup/hold violations and physical implementation issues to achieve sign-off readiness.
• Analyze and address DRC and other implementation violations in coordination with relevant teams.
• Collaborate with STA, synthesis, RTL, and physical verification teams to ensure design quality.
• Support PPA optimization and closure in advanced FinFET technology nodes.
• Ensure adherence to sign-off requirements, design constraints, and project schedules. Required Skills
• 5–10 years of hands-on experience in Physical Design.
• Strong expertise in physical design sign-off and block-level implementation.
• Proven experience with Cadence Innovus.
• Hands-on exposure to TSMC 3nm and/or 2nm process technologies.
• Strong understanding of timing closure, setup/hold analysis, and physical optimization.
• Experience with congestion management, design-rule debugging, and sign-off readiness.
• Solid understanding of advanced-node physical design methodologies and PPA trade-offs. Preferred Qualifications
• Experience with advanced FinFET implementation challenges at 3nm/2nm.
• Exposure to sign-off STA and physical verification flows.
• Strong problem-solving skills and cross-functional collaboration experience. Education B.
E./B.
Tech/M.
E./M.
Tech in Electronics, Electrical Engineering, VLSI, or a related discipline. Ideal Candidate: A hands-on Physical Design Engineer with strong Innovus proficiency, proven sign-off execution experience, and practical exposure to TSMC 3nm/2nm technologies.