Lead Physical Design Engineer

2 days ago

Bengaluru, Karnataka, India ACL Digital Full time ₹ 12,00,000 - ₹ 36,00,000 per year

Job Title:
Lead Physical Design Engineer

Experience:
7+ Years

Location:
Bangalore/Hyderabad

Employment Type:
Full-time

Industry:
Semiconductors / ASIC / VLSI / SoC Design

Job Summary:

We are seeking a highly experienced and technically strong
Lead Physical Design Engineer
to drive RTL-to-GDSII implementation for complex SoC or block-level designs. The ideal candidate will lead a team of engineers, oversee physical design execution, and ensure successful signoff and tapeout across advanced process nodes.

Key Responsibilities:

  • Own and drive block/full-chip physical implementation from RTL to GDSII.
  • Lead floorplanning, placement, clock tree synthesis (CTS), routing, and optimization.
  • Guide timing closure, power integrity (IR/EM), DRC/LVS, antenna, and reliability checks.
  • Define and execute physical design strategies to meet aggressive PPA targets.
  • Interface with cross-functional teams including RTL, STA, DFT, power, and package teams.
  • Plan and manage physical design activities for successful project delivery.
  • Implement low-power design techniques (multi-VDD, power gating) using UPF/CPF.
  • Drive physical design reviews, methodology development, and flow improvements.
  • Mentor and guide junior PD engineers; provide technical leadership and training.

Required Skills and Experience:

  • B.E/B.Tech or M.E/M.Tech in Electronics, Electrical Engineering, or VLSI.
  • 7+ years of strong experience in physical design implementation.
  • Hands-on experience with industry tools:
  • P&R:
    Synopsys ICC2, Cadence Innovus, Siemens Nitro
  • Timing:
    Synopsys PrimeTime
  • Verification:
    Calibre DRC/LVS, RedHawk, Tempus, Voltus
  • Strong command over timing analysis, congestion management, ECOs, and layout optimization.
  • Deep understanding of FinFET/advanced node design challenges (7nm/5nm/3nm).
  • Scripting skills (Tcl, Perl, Python) for design automation and tool integration.
  • Experience in tapeout and signoff processes with foundries like TSMC/Samsung/GF.

Preferred Qualifications:

  • Experience with hierarchical design and chip-level integration.
  • Exposure to 2.5D/3D ICs, chiplets, HBM, or advanced packaging technologies.
  • Knowledge of DFT insertion and formal verification tools.
  • Familiarity with EDA tool flows customization and methodology development.

Interested can share Cv to

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