Associate Electro Mechanical Packaging Design

Associate Electro Mechanical Packaging Design & Analysis Engineer

Company:

Overview

Boeing is the world's largest aerospace company and a leading provider of commercial airplanes, defense, space, and security systems, and global services. Building on a legacy of over a century of innovation and leadership, Boeing continues to lead the way in technology and innovation, customer delivery, and investment in its people and future growth of aerospace.

In India, Boeing has been a strong partner to the Indian aerospace and defense sectors for more than 80 years. People at Boeing have been supporting mission readiness and modernization of India's defense forces, and enabling connected, safer, and smarter flying experiences, in the sky, in the seas, and in space. 

Technology for today and tomorrow

The Boeing India Engineering & Technology Center (BIETC) in India is leveraging a diverse talented pool of  5,500+ engineers, technologists, and innovators to drive growth and innovation in the global aerospace sector These engineers deliver cutting-edge R&D, innovation, and high-quality engineering work in global markets in traditional and emerging areas, and leverage new-age technologies such as AI/ML, IIoT, Cloud, Model-Based Engineering, and Additive Manufacturing, to enhance quality, safety, and productivity for airline customers, shaping the future of aerospace in India for India, and the world.

People-driven culture

At Boeing, we believe creativity and innovation thrives when every employee is trusted, empowered, and has the flexibility to choose, grow, learn, and explore. We offer variable arrangements depending upon business and customer needs, and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration, frequent team engagements, and face-to-face meetings bring diverse perspectives and thoughts – enabling every voice to be heard and every perspective to be respected.  No matter where or how our teammates work, we are committed to positively shaping people's careers and being thoughtful about employee wellbeing. 

At Boeing, we are inclusive, diverse, and transformative.  

With us, you can create and contribute to what matters most in your career, community, country, and world. Join us in powering the progress of global aerospace.

Job Title: Associate Electro Mechanical Packaging Design & Analysis Engineer

Position Overview 

The Boeing India Engineering and Technology Center (BIETC) is looking for a highly motivated and skilled Associate Electro Mechanical Packaging Design & Analysis Engineer to join our team. The ideal candidate will hold a Master's degree (M.Tech) in Mechanical Engineering or a related field from a reputed college and possess a strong background in Thermal engineering, mechanical analysis, including finite element analysis (FEA), thermal analysis, and structural integrity assessments. This role involves conducting trade study, research, thermal and structural design and detailed analyses to support the design and development of complex mechanical systems and components.

Position Responsibilities:

The successful candidate will perform the following duties:

•    Design and develop electro-mechanical packaging solutions that meet thermal management requirements for electronic components and systems.

•    Conduct thermal analysis and simulations to evaluate heat dissipation and ensure that designs operate within safe temperature limits.

•    Collaborating & communicating with cross functional teams and all stakeholders, especially electronics circuit designers, manufacturing engineers and suppliers to ensure that the hardware changes are successfully implementation

•    Stay updated on industry trends and advancements in electro-mechanical packaging and thermal management technologies

•    Drive design changes or updates to improve reliability, manufacturability, or cost-efficiency.

•    Develop and manage work breakdown structures (WBS), track dependencies, and align deliverables with project phases.

•    Must be able to work well in domestic and global teams from a modern innovative and collaborative environment and support technical transition activities.

•    Collaborating & communicating with cross functional teams and all stakeholders, especially electronics circuit designers, manufacturing engineers and suppliers to ensure that the hardware changes are successfully implementation

•    Analyzing Customer & System Requirements to develop mechanical design solutions in coordination with Electronic Unit Managers for mechanical changes 

•    Prepare technical documentation such as  Test procedure , Test Plan, Qual Plan, 

•    Ability to perform design calculations to develop mechanical design solutions and perform tolerance stack-up analysis to ensure proper fit and function of components within the packaging.

•    Executing end-to-end project management, including some configuration management and change control

•    Represent Mechanical Engineering in IPT meetings, design reviews, customer meetings, audits and other activities.

•    Strong problem-solving skills and the ability to proactively think out of the box preferred. 

Language Requirements:

Not Applicable

Education:

Not Applicable

Relocation:

Relocation assistance is not a negotiable benefit for this position.

Security Clearance:

This position does not require a Security Clearance.

Visa Sponsorship:

Employer will not sponsor applicants for employment visa status.

Contingent Upon Award Program

This position is not contingent upon program award

Shift:

Not a Shift Worker (India)

---