Sr. Test Innovation Process Engineer

4 days ago

Taiwan, India NXP Semiconductors Full time ₹ 9,00,000 - ₹ 12,00,000 per year
Job Description

Locations:
Kaohsiung

Time Type:
Full time

Posted On:
Posted Today

Job Requisition ID:
R

Job Responsibilities:
  • Plan and execute projects to evaluate and qualify new test equipment, technologies, and processes to support the fastest path to revenue. The focus is to improve cost, yield, quality, and productivity of test for NXPs Products prior to NPI (New Product Introduction), during NPI, and during production.
  • Analyze and resolve technical issues and challenges in Probe and Final Test working closely with global product/test engineering, test innovation, global hardware engineering, wafer fab process engineering, package innovation, AT (Assembly & Test) engineering, and manufacturing teams.
  • Report experimental results to appropriate User Groups and Project Review Boards across global time zones.
  • Run Experiments on Engineering and Production Test Equipment (Probers/Handlers/Testers).
  • Develop and document new processes for Wafer Test and Final Test Hardware and Equipment.
  • Participate as SME in Test Risk Assessment process to identify, prevent and mitigate risks, securing the introduction of new products.
  • Participate in supplier selection and test technology selection for New Products understanding test sensitivities across Wafer Test and Final Test platforms.
Requirements:
  • Master's/Bachelor's degree in Electronics or Electrical/Mechanical Engineering with 3-5 years of relevant working experience.
  • Knowledge of NXP's BCAM process preferred.
  • Proven skills in failure analysis, test software programming and/or test process development are highly desirable.
  • Proven skills in data analysis, statistical analysis, and design of experiments for methodical problem solving and best test/engineering solution selection.
  • Knowledge of TEL/Accretech Wafer probers.
  • Knowledge of Cohu/Epson Final Test Handlers.
  • Knowledge of ATE Testers is a plus, especially for Advantest ExaScale and Teradyne UltraFlexplus Test systems.
  • Knowledge of Semiconductor Manufacturing is an added advantage.
  • Knowledge of mixed signal and/or digital test techniques for microprocessors, microcontrollers, memories, and DSP is an advantage.
  • Knowledge of UNIX, Perl, C/C is an added advantage.
  • Working knowledge of Lean Manufacturing and Six Sigma tools.
  • Fast learner to meet skills requirement for new and advancing Semiconductor product testing.
  • Self-motivated and positive attitude.
  • Strong in problem solving and continuous improvement.
  • Excellent interpersonal communication skills with all levels and able to work well with cross-functional teams in the local ATKH engineering.
  • Fluent in English communication, both written and verbal.

More information about NXP in Greater China...
#LI-2370
Locations: Kaohsiung

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