Thermal Analysis Lead

4 days ago


Bengaluru, Karnataka, India Sienna ECAD Technologies Full time ₹ 12,00,000 - ₹ 24,00,000 per year

Role & responsibilities

  • Lead and execute thermal analysis for electronic systems at component, PCB, and enclosure levels.
  • Develop and validate thermal models using simulation tools (e.g., ANSYS Icepak, FloTHERM, Simcenter, or equivalent).
  • Conduct steady-state and transient thermal analyses to ensure compliance with design and reliability requirements.
  • Collaborate closely with electrical, mechanical, and system engineers to define thermal requirements early in the design process.
  • Optimize thermal management strategies, including heatsinks, fans, thermal interface materials (TIMs), and airflow designs.
  • Perform root cause analysis for thermal issues observed during prototype or validation testing.
  • Define and review thermal test setups; interpret and correlate test data with simulation results.
  • Provide technical leadership and mentoring to junior thermal engineers and analysts.
  • Support DFMEA and reliability assessments from a thermal perspective.
  • Work with suppliers and vendors to define thermal performance specifications for components and assemblies.
  • Document and present analysis reports, design recommendations, and validation summaries.

Preferred candidate profile

  • Bachelors/Masters degree in Mechanical Engineering, Thermal Engineering, Aerospace, or related field.
  • 6-8+ years of experience in thermal design and analysis of electronic products (PCB-level, power electronics, system-level enclosures).
  • Strong hands-on experience with thermal simulation tools such as ANSYS Icepak, FloTHERM, or Simcenter Flotherm XT.
  • Solid understanding of heat transfer principles (conduction, convection, radiation) and thermal–fluid interactions.
  • Experience in correlating simulation and experimental data for model validation.
  • Familiarity with CAD tools (e.g., Creo, SolidWorks, CATIA, or NX) for geometry preparation and data exchange.
  • Knowledge of electronic component packaging, PCB stack-ups, and cooling methods (passive/active).
  • Proven track record of leading thermal design activities in complex, multi-disciplinary projects.
  • Excellent communication, documentation, and presentation skills.

  • Experience in automotive, aerospace, defense, or consumer electronics thermal design.

  • Knowledge of CFD and multiphysics coupling (electro-thermal or thermo-mechanical analysis).
  • Familiarity with industry standards (e.g., JEDEC, MIL-STD, IEC) for thermal testing and qualification.


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