Die Attached engineer

Photonics Die Attach Engineer Job Descriptions
Job Summary:

Joining our team would be beneficial for you if you have previous expertise working in silicon photonics die attachment engineering. It will be the responsibility of the Photonics Die Attach Engineer to create and execute die attach methods for photonics devices such as silicon dies, laser diodes, optical modulators, lens, and photodiodes. The engineer will work closely with the global SME team and research and development team to create and develop new products. Also, the engineer will be responsible for optimizing the die attach process to achieve high yields and high reliability. In addition to this, the engineer will be responsible for working independently and supporting the development of the process all the way to mass production.

Key Responsibilities:

Develop die attachment methods for silicon photonics devices, such as silicon dies, laser diodes (DFB, EML, VCSEL), optical modulators, lens, and photodiodes, utilizing diverse die attachment methodologies such as eutectic bonding, epoxy dispensing, silver sintering and soldering. Improve die attachment techniques to guarantee high yields and dependability. Collaborate with the SME team and customer in the process development to support and enable the design and development of new products. Work with manufacturing teams to establish and scale up die attachment techniques in a production setting. Establish the mass production process capabilities including the setup, buyoff, maintenance, and audit procedures. Create and maintain documentation for die attachment processes, including process flow diagrams, work instructions, process failure mode effects analysis, and process control plans. Independently design and conduct Design of Experiment, DOE and working with the internal and external Failure Analysis team to establish and optimize the best process parameters and materials for die attach process. Able to plan, conduct, evaluate and optimize the critical parameters for an optimized die attach process through the bond line thickness (BLT), tilt, x-y accuracy, co-planarity, epoxy coverage, fillet height, and shear force. Continually monitor and enhance die attachment methods to maintain quality and performance consistency. Evaluate process data and, if necessary, conduct corrective steps to increase yields and decrease defects. Work with quality and reliability teams to guarantee that die attachment methods satisfy client specifications and industry standards. Work independently to assist the growth of the process until mass production begins. Keep abreast of the most recent advancements in die attach technology and use this information to enhance processes and products.

Qualifications:

• A bachelor's degree in materials science, electrical engineering, or a similar field.
• At least 5 years of experience in developing and improving photonics die attach processes.
• A deep understanding of the materials, processes, and tools used for die attach.
• Familiarity with automated die attach processes and equipment.
• Know how to do flip-chip die attach.
• Familiarity with techniques and tools for optical alignment.
• Experience making photonics devices in large quantities mass production.
• Know how to use techniques for statistical process control and process optimization.
• Great problem-solving skills and the ability to figure out how to fix difficult technical problems.
• Strong communication and teamwork skills, as well as the ability to work well in a team setting.
• Knowledge of how to document processes and check for quality.
• Knowledge of the industry standards for making photonics devices.

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