Vice President Engineering – R&D

14 hours ago

Bengaluru, Karnataka, India HFCL Limited Full time ₹ 15,00,000 - ₹ 20,00,000 per year

Job Title: Vice President (VP) Engineering – R&D (Communication Products)Location: BangaloreJob Type: Full-TimeAbout the Role:We are seeking a dynamic and experienced Vice President (VP) of Engineering to lead our Research & Development (R&D) division for communication products, including Access Points, UBR-P2P, P2MP, and Network Switches. The ideal candidate will have a strong background in wireless communication technologies, networking, and embedded systems.

This role requires strategic vision, hands-on technical expertise, and leadership skills to drive innovation and ensure successful product development. Key Responsibilities:Lead and oversee the entire R&D team, ensuring the successful development of communication products. Define the technology roadmap and drive innovation in wireless networking, RF design, and embedded systems.

Manage the design, development, testing, and deployment of Access Points, UBR-P2P, P2MP, and Network Switches. Collaborate with cross-functional teams including Product Management, Manufacturing, and Sales to align technical developments with business goals.

Ensure compliance with industry standards (IEEE 802.11, Wi-Fi, 5G, IoT, etc.) and regulatory requirements. Drive cost optimization and performance improvements in hardware and firmware design. Mentor and develop a team of engineers, fostering an innovative and high-performance culture.

Stay updated with the latest networking technologies, protocols, and emerging trends to maintain a competitive edge. Work closely with external partners, vendors, and research institutions to explore new advancements. Required Qualifications & Experience:Bachelor's/Master's/PhD in Electrical Engineering, Computer Science, or related field.15 years of experience in wireless communication, networking, and embedded systems development.

Proven expertise in Access Points, UBR-P2P, P2MP, Ethernet Switches, and RF technologies. Strong knowledge of network protocols, software-defined networking (SDN), and cloud-managed networking.Experience in leading large-scale engineering teams and managing multiple product lines.

Hands-on experience in embedded firmware development (C, C , Linux, RTOS). Understanding of hardware design (PCB, RF, ASIC, FPGA) and firmware integration. Strong problem-solving skills with a strategic and analytical mindset.

Excellent leadership, communication, and stakeholder management skills. Preferred Qualifications:Experience with Wi-Fi 6/6E/7, IoT, and AI-driven networking solutions. Knowledge of network security, cloud computing, and edge computing architectures.

Experience in patent filings and R&D grants. Why Join Us?

Be at the forefront of cutting-edge wireless communication and networking innovations. Lead a highly talented R&D team in shaping the future of connectivity. Competitive compensation, stock options, and career growth opportunities.

If you are passionate about leading R&D in next-generation communication products, apply now to be part of our growing team

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