MSIP Senior Digital Design Engineer

9 hours ago

Noida, Uttar Pradesh, India Qualcomm Full time ₹ 15,00,000 - ₹ 25,00,000 per year

General Summary:

As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications:

Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. ORMaster's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. ORPhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Responsibilities

  • Front-End implementation of MSIP(Temp/Voltage/Security Sensors, Controllers) designs
  • RTL development and its validation for linting, clock-domain crossing, conformal low power and DFT rules.
  • Work with functional verification team on test-plan development and debug.
  • Develop timing constraints, deliver synthesized netlist to physical design team, and provide constraints support for PD STA.
  • UPF writing, power aware equivalence checks and low power checks.
  • DFT insertion and ATPG analysis for optimal SAF, TDF coverage.
  • Provide support to SoC integration and chip level pre/post-silicon debug.

Skills & Experience

  • MTech/BTech in EE/CS with hardware engineering experience of 3+ years.
  • Experience in micro-architecture development, RTL design, front-end flows (Lint, CDC, low-power checks, etc.),synthesis/DFT/FV/STA.
  • Experience with post-silicon bring-up and debug is a plus.
  • Able to work with teams across the globeand possess good communication skills.

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