Wire Bond Engineer

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Photonics Wire Bonding Engineer Job Descriptions

Job Summary:

We require an accomplished Photonics Wire Bonding Engineer to join our team. The Photonics Wire Bonding Engineer will develop and implement wire bonding procedures for silicon photonics devices such as silicon dies, laser diodes, optical modulators, and photodiodes. The engineer will collaborate closely with the global SME and R&D team to create new products and will be responsible for optimizing the wire bonding process to achieve high yields and high dependability. In addition, the engineer will be required to work autonomously and assist the development of the process till mass production.

Key Responsibilities:

Design and develop wire bonding processes for silicon photonics devices, including silicon dies, laser diodes, optical modulators, and photodiodes, using various wire bonding methodologies including ribbon bond, ball bond, and wedge bond. Optimize wire bonding processes including 0.8mil, 1.0mil, 1.2mil Au wires, and Ribbon bond to ensure high yields and high reliability. Evaluate the selection of optimum bond capillary type, Au wire type for the required application. Experienced in various wire bonding controls such as Ball Stitch on Ball (BSOB), Bond Ball on Stitch (BBOS), Ball Stitch on Stitch (BSOS). Work closely with the global SME team and R&D team to design and develop new products. Collaborate with manufacturing teams to implement and scale-up wire bonding processes in a production environment. Develop and maintain documentation related to wire bonding processes, including process flow diagrams, work instructions, and process control plans. Continuously monitor and improve wire bonding processes to ensure consistent quality and performance. Analyze process data and implement corrective actions as needed to improve yields and reduce defects. Able to plan, conduct, evaluate and optimize the critical parameters for an optimized wire bonding process through the wire shape and loop height, ball shear force, pull test, ball size, ball aspect ratio (BAR), IMC percentage and cratering check.  Collaborate with quality and reliability teams to ensure that wire bonding processes meet customer requirements and industry standards. Work independently to support the process development until mass production. Stay up to date with the latest developments in wire bonding technology and apply that knowledge to improve processes and products.

Qualifications:

• Bachelor's degree in electrical engineering, materials science, or a related field.

• At least 5 years of experience in photonics wire bonding process development and optimization.

• Strong understanding of wire bonding materials, processes, and equipment.

• Experience with automated wire bonding equipment and processes.

• Familiarity with optical alignment techniques and equipment.

• Experience with high-volume manufacturing of photonics devices.

• Experience with statistical process control and process optimization techniques.

• Excellent problem-solving skills and ability to troubleshoot complex technical issues.

• Strong communication and collaboration skills, with the ability to work effectively in a team environment.

• Experience with process documentation and quality control methodologies.

• Familiarity with industry standards for photonics device manufacturing.

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