Principal/staff- Signal Integrity

PRIMARY PURPOSE:Provide signal integrity design support for new and/or existing interconnect solutions. Develop new or advanced technologies in signal integrity design support capabilities. Provide technical leadership and directions in planning and management of new product development from product definition, concept, design, development, qualification, and successfully lunching of new products to the market. DUTIES & RESPONSIBILITIES: Perform characterization of high-speed connectors and systems through the use of high-speed digital testing and electromagnetic modelling techniques. Develop empirical and analytical electrical test procedures and specifications. Perform testing based on available design input requirements Design characterization test boards and customer verification boards; work with PCB design houses. Provide PCB routing guidence to customers to maintain signal integrity performance while adhereing to the customers prefered PCB technologies and DFM rules. Generate evaluation and qualification reports or presentation materials for both internal and customer use. Provide expert advice to Marketing,Sales and/or customers on signal integrity related matters. Lead research and development work on or advanced technologies in electrical design capabilities. May be assigned to lead and manage the overall performance of the Signal Integrity function. Drive innovative and challenging concepts for interconnect design breakthrough. Other duties as assigned by Management. TECHNICAL RESPONSIBILITIES Participate in Industry Standards Committee or Association activities. Provide technical training on Signal Integrity to Product Design Engineering, Marketing and Sales personnel or others as required. Prepare and conduct technical presentations to Sales, Marketing and/or Customers. Be up to date with Industry trend on high speed interconnect technologies that includes Silicon, package, hardware, system architecture, etc. and share information among team members. Invovled with industrial co-development for next generation IO/platform/signalling/interconnect enabling. Academia collaboration (research papers/PHD programs) PSR filing and Technical papers publication (IEEE/Design Conn) annually. SUPERVISORY RESPONSIBILITIES (When applicable) Supervise lower level engineers. Review and set performance goals. Conduct performance appraisal. Provide feedback and implement improvement actions on staff performance as required. SCOPE:This job supports both Overseas as well as US-based employees. To lead technical team. To help develop / support new and existing products that meets or exceeds customer expectations. Provide guidance for new product development to generate revenue and growth for Business Unit. EDUCATION: REQUIRED:Bachelor degree in Electrical and Electronic Engineering or equivalent Major in Microwave Engineering PREFERRED:MS and Ph.D. in the above fields WORK EXPERIENCE: REQUIRED:At least 7 years of related working experience for a degree holder PREFERRED:Designing and supporting high speed electrical interconnects Experience with available CAD/CAE tools such as Channel Designer, HFSS, CST, FDTD tools, MoM tools, Sigrity PowerSI, PAKSI-E, Power-grid, Agilent ADS, Agilent PLTS, Cadence CAD tools Experience correlating simulation results with lab measurements using oscilloscopes, TDRs and VNAs is essential. Capability of scripting/automating the analysis flow with point tool SKILLS & ABILITIES: REQUIRED:In depth understanding of electromagnetics and transmission line theory Proficient in using simulation to drive optimizations of a connector design Familiarity with PCB technologies (HDI, Substrate, etc.) and their DFM rules Technical and organizational skills Demonstrated ability to work with cross-functional teams in providing design feedback which provides optimal signal integrity performance without sacrificing mechanical integrity and/or manufacturability Demonstrated ability in information analysis problem solving, sound judgment, and leadership. Good verbal and written skills for exchange of information in a clear and concise manner. Demonstrated ability to work effectively within a team environment PREFERRED:Supervising and technical leadership experience System engineering background Expert with EM modelling software’s such as ANSYS and/or CST Microwave