IP Project-Principal Engineer

1 month ago


bangalore, India NXP Semiconductors Full time

Job Title- IP Project-Principal EngineerPrimary Location: Bangalore, IndiaWe are part of MCU/MPU Engineering, a central design organization within NXP, developing products for multiple business lines in Automotive, Internet of Things (IoT), Networking, and Radio Frequency products, with expertise in hardware engineering, including architecture, IP, and full SoC Design. MME's Digital IP team produces design solutions covering the very wide range of SoCs required by the business lines. The team is challenged to produce industry-leading solutions covering very cost-sensitive, low-power devices to highly integrated, high-performance, multi-cohort devices compliant with the latest automotive and industrial safety and security standards.Job Responsibility: Responsible for end to end execution & delivery of all IPs into the SoCEscalate up to the management chain for any risk in terms of IP quality or schedule.Actively drive technical challenges discussions and decision making within IP scope.Must use technical abilities to make decisions on IP features.Must be capable of making priority calls for IPs being delivered to an SoCWork closely with IP design and verification teams and ensure compliance to methodology, sign-offs and delivery timelinesDrive project meetings with IP development teams and track progress, risks and feature change requestsProvide basic IP integration support to SoC; represent IP in SoC logic freeze and tape out reviewsRepresent IP teams in audits with quality & safety organizationsJob Qualification:B.Tech/M.Tech with 12+ years of industry related experienceGood understanding of IP development process and methodologyExperience with SoC Processor based architectures a plus.Experience in protocols like AHB/AMBA, Memory (ROM, RAM, Flash, LPDDR/DDR3/4) and memory controllers a plus.Experience in all aspects of RTL design flow from Specification/Micro-architecture definition to design and verification, Timing Analysis, DFT and Implementation a plusGood understanding on Chip Assembly, IP Integration, RTL signoff tools and CDC/RDC/Lint/Synthesis.Able to work effectively with global teams; self-motivated to solve problems and manage deliverablesExcellent interpersonal and communication skillsExcellent leadership and negotiation skills



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