AMS IO Expert

Purpose: We are seeking a highly skilled and motivated IO Design Expert with deep experience in designing GPIOs, specialty analog/digital IOs, and ESD protection circuits across technology platforms ranging from BCD technologies (e.g., 180nm/130nm/55nm) to advanced CMOS nodes (e.g., 28nm, 16nm, 12nm, 7nm, 5nm). You will play a critical role in the architecture, schematic design, layout oversight, simulation, verification, and qualification of IO libraries for complex SoCs with stringent reliability and performance requirements. Areas Of Responsibility: Architect and design a wide range of IO cells: General Purpose IOs (GPIOs) High-Speed IOs (LVDS, CML, SSTL, HSTL, etc.) Power IOs (e.g., VDD, VSS pads) Analog IOs for sensor interfaces, ADC/DAC connections ESD protection devices and clamps (CDM, HBM, MM compliance) High-voltage tolerant IOs (for BCD technologies) Collaborate with system architects and package designers to define pad ring structure, signal assignments, and power integrity constraints. Lead IO library development, including reusable IP blocks across multiple SoCs and technology platforms. Perform corner simulations (PVT, aging, mismatch) and electrostatic discharge simulations to ensure design robustness. Validate designs through post-layout verification, LVS/DRC, and EM/IR checks. Work with layout engineers to guide physical design and ensure DFM compliance. Interface with foundries for tapeout, IP sign-off, and PDK updates. Lead silicon characterization, correlation with simulations, and root-cause analysis for silicon issues. Ensure compliance with automotive (AEC-Q100), industrial, and consumer qualification requirements when applicable. Experience and Qualification: Master’s/Bachelor’s degree in Electrical Engineering, Microelectronics, or related field. 10+ years of experience in custom analog/mixed-signal IO design. Proven track record of IO designs in BCD (e.g., 180nm, 130nm) and advanced FinFET/SOI nodes (e.g., 28nm, 16nm, 7nm). Strong understanding of: ESD design techniques Latch-up prevention IO reliability (TDDB, HCI, NBTI) Signal and power integrity in IO domains Packaging parasitics and bondpad modeling Proficiency in Cadence Virtuoso, Spectre, Calibre, HSPICE, or equivalent tools. Deep experience with foundry PDKs, DRC/LVS, and analog layout best practices. Familiarity with automotive-grade and industrial-grade design requirements. Excellent problem-solving, communication, and documentation skills. Technical And Behavioural Skills: Strong written and verbal communication skills. Proactive, collaborative, and creative approach to innovation, technical development and consensus facilitation to influence optimal project results. Strong team player. Staying updated with the latest IO Design techniques, standards, and tools. Self-Motivated; Team player; Fast Learner; Analytical Having patents on names and papers in IEEE journals will be greatly appreciated Excellent problem-solving, analytical, and communication skills. Ability to work effectively in a collaborative team environment. Experience with multi-voltage IOs, level shifters, or high-speed SERDES IO interface support. Exposure to chip-level ESD strategy and pad ring co-design with digital place-and-route teams. Knowledge of chip-package-board co-design and related modeling techniques. Familiarity with IP qualification documentation (e.g., IO validation reports, ESD/EMC results, corner simulation logs, etc.). Qualifiers for the Role / Necessary Experience and Skills Required for the Role: Bachelor’s/Masters/PhD degree in engineering in Electronics and Electrical Engineering with excellent academic records.