
Senior Process Assembly Lead
2 days ago
This position is focused on driving process excellence in assembly operations, optimizing yields, and ensuring smooth ramp-up of new technologies.
- Lead process development and optimization for semiconductor packaging (Die Attach, Wire Bond, Molding, Wafer Bumping, Singulation, Underfill, Encapsulation, etc.).
- Monitor key process parameters, identify bottlenecks, and drive yield improvements.
- Support NPI from customer design handover to stable mass production.
- Collaborate with equipment engineers to drive tool qualification, calibration, and process stability.
- Conduct failure analysis, root cause investigation, and corrective action implementation.
- Ensure adherence to industry standards and EHS compliance in cleanroom operations.
- Work with global customers and cross-functional teams to meet quality, delivery, and cost targets.
- Mentor junior engineers and technicians on best practices in OSAT process engineering.
The ideal candidate should have 8-12 years of experience in semiconductor assembly/test, ATMP, or OSAT environment and a strong hands-on expertise in at least one core process area.
Bachelor's / Master's in Mechanical, Electronics, Electrical, Materials, or related Engineering field is required. Familiarity with SPC, DOE, FMEA, Six Sigma, Lean Manufacturing methodologies and excellent analytical, problem-solving, and communication skills are essential.
Key Responsibilities:
- Develop and optimize processes for advanced semiconductor assembly, packaging, and testing.
- Liaise with cross-functional teams to ensure smooth project execution.
- Drive process improvements and maintain high-quality standards.
Requirements:
- Bachelor's/Master's degree in relevant field.
- 8-12 years of experience in semiconductor assembly/test or OSAT environment.
- Familiarity with process improvement methodologies.
- Excellent analytical and problem-solving skills.
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