
Lead System Architect for Next-Generation Interconnects
1 week ago
A leader in CPU Architecture and Logic design is sought after to drive the quantum revolution and AI era.
- Responsible for the micro architecture, design, and development of high-bandwidth, low-latency on-chip interconnects.
Key Responsibilities
- Design and architect different interconnect topologies driven by bandwidth, latency, and RAS requirements.
- Develop features and present proposed architectures in High-Level Design discussions.
- Develop micro-architecture, Design RTL, collaborate with Verification, DFT, Physical Design, FW, SW teams to develop features.
- Sign-off Pre-silicon Designs meeting functional, area, and timing goals.
- Participate in silicon bring-up and validation of hardware.
Requirements
- At least 1 generation of processor interconnect design delivery leadership (e.g., UPI, AXI, AMBA, NoC).
- Expertise in SMP coherency.
- Experience in different on-chip interconnect topologies (e.g., mesh, crossbar).
- Understanding of various snoop and data network protocols.
- Understanding of latency & bandwidth requirements and effective means of implementation.
- Working knowledge of queuing theory.
- NUMA/NUCA architecture.
- Proficient in HDLs - VHDL / Verilog.
- Experience in high-speed and power-efficient logic design.
- Experience in working with verification, validation, physical design teams for design closure including test plan reviews and verification coverage.
- Good understanding of Physical Design and able to collaborate with physical design team for floor planning, wire layer usage and budgets, placement of blocks for achieving high-performance design.
- Experience in leading uarch, RTL design teams for feature enhancements.
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