Chief Architect of High-Performance On-Chip Interconnects
6 days ago
Job Title: Chief Architect of High-Performance On-Chip Interconnects
About the Role:
We are seeking an experienced leader to head our on-chip interconnect architecture team. As a key member of our Systems division, you will be responsible for designing and architecting high-performance on-chip interconnects.
Your Key Responsibilities:
- Design and Architect Interconnect Topologies
- Develop Features and Present Proposed Architectures
- Collaborate with Verification, DFT, Physical Design, FW, and SW Teams
- Signoff Pre-silicon Designs Meeting Functional, Area, and Timing Goals
- Participate in Silicon Bring-up and Validation
Requirements:
- Masters Degree in Computer Science or related field
- 8+ Years of Relevant Experience in Processor Interconnect Design Delivery
- Leadership Experience in Processor Interconnect Design Delivery
- Expertise in SMP Coherency and On-Chip Interconnect Topologies
- Understanding of Snoop and Data Network Protocols
- Working Knowledge of Queuing Theory and numa/nuca Architecture
- Proficient in HDLs (VHDL/Verilog) and High-Speed Logic Design
About This Opportunity:
Mulya Technologies is a leading technology company driving innovation in the AI era. We offer a collaborative and dynamic work environment with opportunities for growth and development.
Your Benefits:
You will have access to cutting-edge technologies and tools to design and develop innovative solutions. You will also have opportunities to collaborate with talented engineers and scientists from around the world.
Come Join Our Team:
We are committed to creating a diverse and inclusive workplace where everyone can thrive. We believe that diversity drives innovation and we are proud to be an equal opportunity employer.
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