Semiconductor Packaging Expert
3 days ago
We are seeking a pioneering Senior Technical Manager with extensive experience in wire-bonding to join our team. As a key member of our technical leadership, you will be responsible for developing and optimizing wire-bonding processes.
The ideal candidate should have:
- At least 5–10 years of hands-on experience in wire-bonding, specifically in OSAT/semiconductor packaging
- Strong process + equipment troubleshooting expertise
- Knowledge of the 4M framework (Man, Material, Machine, Method)
- Experience mentoring or leading teams
As a Senior Technical Manager, you will work closely with local teams, develop training programs, and act as a subject matter authority for all wire-bonding issues. If you are passionate about semiconductor packaging and leadership opportunities, we encourage you to apply.
Key Responsibilities:
- Developing and optimizing wire-bonding processes using gold, copper, and aluminum wire bonding
- Troubleshooting equipment and designing tooling/window clamps
- Training and guiding local teams
- Acting as the subject matter authority for all wire-bonding issues
Ideal Candidate Qualifications:
- Proven track record in wire-bonding with a strong focus on process development and optimization
- Excellent communication and leadership skills
- Ability to work collaboratively with cross-functional teams
- Passion for continuous learning and professional growth
Join us in shaping India's semiconductor future
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