Senior IC Packaging Professional

2 weeks ago


Bengaluru, Karnataka, India Tata Electronics Full time

Company Overview:

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Tata Electronics is a leading provider of electronics manufacturing services. We pride ourselves on delivering high-quality products and exceptional customer service. Our team is dedicated to excellence and strives to exceed customer expectations.

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Job Summary:

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We are seeking an experienced Senior IC Packaging Professional to join our team at Tata Electronics. As a key member of our engineering team, you will be responsible for leading the technology and process development for Wire Bonding/Flip Chip packaging engineering.

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Key Responsibilities:

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  • Develop and implement new technologies and processes to improve product quality and reduce costs.">
  • Collaborate with cross-functional teams to ensure seamless execution of projects.">
  • Lead the selection of vendors and suppliers based on their technical capabilities and business acumen.">
  • Provide training and guidance to junior engineers to develop their skills and expertise.">
  • Analyze and resolve complex technical issues related to packaging engineering.">
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Requirements:

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To be successful in this role, you will need a minimum relevant engineering or Science degree, experience in leading a group or team of employees in the achievement of organizational goals, exposure in MS office, 8D writing, DOE, SPC, FMEA, OCAP and Control Plan. A passion for achieving what's not possible via innovation and continuous learning is essential.

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Benefits:

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Tata Electronics offers a comprehensive benefits package that includes medical, dental and vision insurance, 401(k) matching, paid time off, and professional development opportunities.



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