Chief Assembly Technologist

We are seeking a seasoned Senior Process Engineer to join our team. The ideal candidate will have experience in semiconductor assembly/test, ATMP, or OSAT environment.

About the Role

The Senior Process Engineer will be responsible for driving process excellence in assembly operations, optimizing yields, and ensuring smooth ramp-up of new technologies.

• Lead process development and optimization for semiconductor packaging (Die Attach, Wire Bond, Molding, Wafer Bumping, Singulation, Underfill, Encapsulation, etc.).
• Monitor key process parameters, identify bottlenecks, and drive yield improvements.
• Support NPI (New Product Introduction) from customer design handover to stable mass production.
• Collaborate with equipment engineers to drive tool qualification, calibration, and process stability.
• Conduct failure analysis, root cause investigation, and corrective action implementation.
• Ensure adherence to industry standards (JEDEC, ISO, IATF) and EHS compliance in cleanroom operations.
• Work with global customers and cross-functional teams to ensure quality, delivery, and cost targets are met.
• Mentor junior engineers and technicians on best practices in OSAT process engineering.

Key Responsibilities

The successful candidate will have:

• Bachelor's / Master's in Mechanical, Electronics, Electrical, Materials, or related Engineering field.
• 8–12 years of relevant experience in semiconductor assembly/test, ATMP, or OSAT environment.
• Strong hands-on expertise in at least one core process area (Wire Bonding, Die Attach, Molding, WLP, Fan-out, etc.).
• Proven track record in yield improvement and process stabilization.
• Familiarity with SPC, DOE, FMEA, Six Sigma, Lean Manufacturing methodologies.
• Experience working in a cleanroom environment.
• Excellent analytical, problem-solving, and communication skills.

Requirements

The ideal candidate will possess:

• Bachelor's / Master's in Mechanical, Electronics, Electrical, Materials, or related Engineering field.
• 8–12 years of relevant experience in semiconductor assembly/test, ATMP, or OSAT environment.
• Strong hands-on expertise in at least one core process area (Wire Bonding, Die Attach, Molding, WLP, Fan-out, etc.).
• Proven track record in yield improvement and process stabilization.
• Familiarity with SPC, DOE, FMEA, Six Sigma, Lean Manufacturing methodologies.
• Experience working in a cleanroom environment.
• Excellent analytical, problem-solving, and communication skills.

Benefits

The selected candidate will enjoy:

• CTC Range: ₹30-35 LPA (commensurate with experience & expertise).
• Benefits: PF, Medical Insurance, Relocation Assistance, Performance Bonus.
• Opportunity to be part of India's fastest-growing semiconductor ecosystem with global exposure.