Electronics Packaging Engineer

1 week ago


Bengaluru, Karnataka, India Tata Electronics Full time

Tata Electronics is seeking a skilled Electronics Packaging Engineer to lead the development of innovative packaging solutions for our semiconductor products. As a key member of our team, you will be responsible for advancing our technology and process capabilities in wire bonding and flip chip packaging engineering.

The successful candidate will have a minimum relevant engineering or science degree and experience in leading a group or team of employees. You should also possess expertise in MS Office, 8D writing, DOE, SPC, FMEA, OCAP, and Control Plan.

Your primary objectives will include:

  • Developing and implementing cost-competitive DFM solutions that meet customers' packaging requirements.
  • Initiating and engaging in technical discussions with vendors to gather relevant data and complete analysis for final decision submission.
  • Installing, buying off, and qualifying processes and products for development, NPI, and LVM.
  • Executing multiple department projects and identifying all process controls requirements.
  • Assisting in MES automation of material, process, and recipe controls.

We offer a dynamic work environment with opportunities for innovation and continuous learning. If you are passionate about achieving what's not possible and have a drive for excellence, we encourage you to apply.



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