Tech Innovation Manager

Job Opportunity

We are seeking a seasoned professional to lead our innovation efforts and drive next-generation product development.

The ideal candidate will possess a strong background in electronics, embedded systems, and mechanical design, with the ability to lead and evaluate work across all three domains.

Main Responsibilities:

• Lead cross-functional engineering teams to ensure alignment with project goals and technical excellence.
• Oversee end-to-end product development, ensuring performance, durability, and manufacturability.
• Define system architecture, guide technical decision-making, and ensure synergy across hardware, firmware, and mechanical domains.
• Foster a culture of innovation by guiding rapid prototyping efforts, encouraging new ideas, and exploring emerging technologies for next-generation products.
• Ensure seamless integration across electrical, mechanical, and embedded components, with a focus on IP-rated (IP65/IP68) ruggedized systems for harsh environments.
• Review and approve designs, schematics, PCB layouts, enclosure models, and firmware structures to maintain technical quality and compliance with industry standards.
• Oversee testing, validation, and debugging across all subsystems using industry-standard lab tools and methodologies.
• Plan and manage resources, timelines, and deliverables across multiple concurrent R&D projects.
• Ensure high-quality documentation across all disciplines for manufacturing, compliance, assembly, and certification processes.
• Mentor engineers across disciplines, facilitate technical reviews, and drive collaboration to solve complex challenges in a fast-paced innovation environment.

Required Skills & Qualifications:

• Strong multidisciplinary background in electronics, embedded systems, and mechanical design.
• Proficiency in electronic circuit design, simulation, and analysis using industry-standard tools.
• Deep understanding of PCB design, schematic capture, and multi-layer board development, including best practices for signal integrity, thermal management, and EMI/EMC compliance.
• Familiarity with embedded systems architecture, microcontroller platforms, and firmware development workflows.
• Knowledge of ruggedized mechanical design, including IP65/IP68-rated enclosures, thermal design, and environmental sealing.
• Proficiency in DFM and DFA across electrical and mechanical components.
• Hands-on experience with prototyping and validation, including the use of lab equipment such as oscilloscopes, logic analyzers, and environmental testing tools.
• Strong understanding of product lifecycle management, BOM management, and technical documentation processes.
• Proven ability to lead cross-functional engineering teams, drive collaboration, and manage complex technical programs.
• Excellent project planning, resource management, and decision-making skills.
• Strong verbal and written communication skills for cross-disciplinary coordination, reporting, and documentation.

Benefits:

• Competitive compensation package.
• Opportunities for professional growth and advancement.
• Collaborative and innovative work culture.
• Exposure to cutting-edge technologies and projects.

Other Requirements:

• Bachelor's or Master's degree in Electronics Engineering, Mechanical Engineering, Embedded Systems, Mechatronics, or a related technical field.
• Additional certifications in product design, embedded systems, systems engineering, or project management are a strong advantage.
• Prior experience in defence, industrial, or high-reliability product development involving integrated hardware, firmware, and mechanical systems is highly desirable.
• Minimum of 15 years of progressive engineering experience, with at least 7–10 years in a technical leadership or managerial role overseeing cross-functional engineering teams.
• Demonstrated ability to lead multidisciplinary R&D projects, drive innovation, and deliver complex products from concept to commercialization.

Application Instructions:

• Please submit your CV and cover letter for consideration.