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Senior Packaging Technologist
3 weeks ago
We are seeking an experienced and skilled Senior Process Engineer to drive process excellence in assembly operations, optimize yields, and ensure smooth ramp-up of new technologies.
The ideal candidate will have a strong background in semiconductor packaging, including experience with die attach, wire bonding, molding, wafer bumping, singulation, underfill, encapsulation, and other related processes.
Key Responsibilities:
- Lead process development and optimization for semiconductor packaging.
- Monitor key process parameters, identify bottlenecks, and drive yield improvements.
- Support NPI from customer design handover to stable mass production.
- Collaborate with equipment engineers to drive tool qualification, calibration, and process stability.
- Conduct failure analysis, root cause investigation, and corrective action implementation.
- Ensure adherence to industry standards (JEDEC, ISO, IATF) and EHS compliance in cleanroom operations.
- Work with global customers and cross-functional teams to ensure quality, delivery, and cost targets are met.
Requirements:
- Bachelor's / Master's in Mechanical, Electronics, Electrical, Materials, or related Engineering field.
- 8–12 years of relevant experience in semiconductor assembly/test, ATMP, or OSAT environment.
- Strong hands-on expertise in at least one core process area (Wire Bonding, Die Attach, Molding, WLP, Fan-out, etc.).
- Proven track record in yield improvement and process stabilization.
- Familiarity with SPC, DOE, FMEA, Six Sigma, Lean Manufacturing methodologies.
- Experience working in a cleanroom environment.
- Excellent analytical, problem-solving, and communication skills.
