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Engineering Collaboration Director for Package Devices

1 week ago


Hyderabad, Telangana, India Micron Semiconductor Asia Operations Pte. Ltd Full time
About Micron Semiconductor Asia Operations Pte. Ltd.
We are a world leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

Job Summary:
The Engineering Collaboration Director for Package Devices will lead and manage the engineering collaboration with internal stakeholders to ensure comprehensive component packaging test coverage. This role requires extensive experience in package device product engineering, preferably in a managerial role, and a strong understanding of component packaging, technology nodes, NPI, and Failure Analysis.