eNVM BEOL Process Integration Lead

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.

Job Summary:

Tata Semiconductor Manufacturing Pvt. Ltd. (TSMPL) is seeking an experienced BEOL Process Integration Lead to drive the development and optimization of embedded non-volatile memory (eNVM) technologies, including eFlash, RRAM, MRAM, and FeRAM across CMOS nodes from 130nm to 28nm, including BCD and FinFET platforms. This role involves leading integration setup, process development, and stabilization to meet performance, reliability, and manufacturability goals. Responsibilities include technology transfer, yield improvement, and troubleshooting, with a strong focus on driving lot execution and achieving key development and qualification milestones.

Responsibilities:

• Lead eNVM (eFuse, eFlash, RRAM, MRAM, and FeRAM) process integration across nodes (130nm to 28nm), including BCD and FinFET technologies
• Guide cross-functional teams to execute lots and meet development, qualification, and ramp milestones
• Collaborate with tool and module owners to optimize BEOL processes for eNVM cell integration
• Design and execute experiments (DOE) to refine BEOL steps: deposition, patterning, etching, and interconnect formation
• Analyze data to resolve integration issues and improve yield, reliability, and manufacturability
• Define and implement process flows, design rules, test structures, and inline/ET specs during technology development
• Lead prototyping activities (e.g., minesweeper lots, skew splits) from tapeout to execution
• Ensure successful mass production ramp through safe launch procedures and qualification of customer samples
• Transfer and standardize BEOL processes across manufacturing sites while maintaining quality and consistency
• Collaborate with process, design, and test teams to ensure seamless BEOL integration
• Characterize electrical and physical performance of interconnects (metal lines, vias, etc.)
• Apply SPC, DOE, and statistical analysis to optimize process windows and control strategies including FMEA, 8D, 5-Ways.
• Leverage equipment knowledge to define development plans and inline characterization strategies
• Innovate and continuously improve BEOL processes to meet evolving device and program requirements
• Prolific in filing innovative solutions as disclosures

Qualifications:

• 5-15 years’ experience in the semiconductor industry with eNVM BEOL
• B.Tech, MS, or PhD in Physics, Electrical Engineering, or related field with strong CMOS process integration knowledge
• Experience in process/device integration or engineering for embedded memories (eFlash, RRAM, MRAM, FeRAM)
• Solid understanding of semiconductor wafer processing, device physics, and product engineering
• Proven expertise in eNVM cell design and integration; familiarity with automotive-grade memory qualification (AEC-Q100)
• Knowledge of key process modules, yield enhancement, DFM methodologies, and process variation constraints
• Skilled in DOE, SPC, and data analysis for process optimization and issue resolution
• Strong cross-functional collaboration with process, device, product, and fab operations teams

Desired Attributes:

• For lead position, need to have strong leadership skills with experience in mentoring and motivating high-performing teams
• Effective communicator and collaborator across global, cross-functional groups
• Inclusive and adaptable to diverse cultural and professional environments
• Curious, resilient, and data-driven in approaching challenges
• Builds strong relationships and offers support with humility
• Innovative and agile, quick to explore new ideas and embrace change