Design Lead for High-Speed Analog IPs

2 weeks ago

Koṭa, India beBeeAnalogLayout Full time

Job OverviewWe are seeking a highly experienced Senior Analog Layout Engineer to lead the development and delivery of high-speed analog IPs at the chip level.This role requires deep knowledge of ICC2-based top-level integration, extensive IP verification experience, and the ability to run block-level simulations independently.The ideal candidate will take full ownership of IP development, verification, integration, and delivery including foundry coordination, signoff, and tape-out.Key ResponsibilitiesAnalog Layout & Integration:Lead chip-level planning and integration of high-speed analog IPs.Run post-layout simulations (corners, Monte Carlo, extracted netlist) and ensure correlation with schematic.IP Verification & Signoff:Own the entire IP verification process: DRC, LVS, ERC, ANT, PEX, and reliability checks.Ensure zero-violation GDS delivery for IP signoff.Work closely with foundry teams on PDK clarifications, rule updates, model issues, PEX discussions, and tape-out requirements.Cross-Functional Collaboration:Coordinate with PD, DV, circuit design, packaging, and integration teams for seamless IP delivery.Prepare and deliver comprehensive IP documentation, abstracts, verification reports, and final GDS.Required Skills and QualificationsMandatory hands-on experience with TSMC 5nm.Strong understanding of ICC2 flows for complete SoC/top-level integration.Ability to run extracted and post-layout simulations for designed blocks.8+ years of proven experience in Analog/Mixed-Signal Layout.Deep expertise in high-speed IPs: SERDES, PLL, ADC/DAC, Tx/Rx, clocking blocks.Strong understanding of chip-level hierarchy, integration, and physical interfaces.Proficiency in Cadence Virtuoso, PVS, Calibre, and extraction tools.In-depth knowledge of:DRC/LVS/ERCPEX & RC ExtractionSignoff decks and reliability checksExperience interfacing with foundry teams for rule clarifications and tape-out signoff.Strong sense of ownership in IP development, customer communications, and documentation.Good to HaveExperience with other advanced process nodes (7nm/3nm).Exposure to SERDES/PCIe/MIPI/USB high-speed IPs.Experience working with global clients.

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