Lead IC Package Layout Design Engineer

2 weeks ago


karnataka, India beBeeIC Full time

Job Title: Lead IC Package Layout Design EngineerAbout the Role:This challenging role involves developing high-quality package designs for ICs. We seek an expert in layout design with experience using Cadence Allegro APD and a good understanding of package/substrate design principles.Key Responsibilities:Designing IC packages with optimal thermal performance, electrical characteristics, and manufacturabilityCollaborating with cross-functional teams to develop product roadmaps and optimize design cyclesApplying expertise in constraint setting, stackup design, and substrate DFM/DFA rules to ensure reliable package performanceDeveloping and implementing design automation tools and methodologies to improve productivity and efficiencyRequirements:Master's or Bachelor's degree in Electrical Engineering, Electronics Engineering, or related fieldMinimum 6 years of experience in IC package layout design, preferably with Cadence Allegro APDExpertise in High-Speed Complex PCB and Package designs with HDI, Blind and Buried Via technologiesHands-on experience with PCB and Package layout designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES and Type CWhat We Offer:A dynamic work environment with opportunities for growth and professional development, competitive compensation and benefits, and a collaborative team culture that values innovation and creativity.



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