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Mechanical Design Engineer
3 months ago
Summary:
Experience: 6 + Years (Mid level Senior)
Education: ME/M.Tech/ME / B.Tech. – Mechanical
Industry Type: R&D, Manufacturing of state-of-the-art railways grade electro mechanical products
Role: Design & Engineering, Product Testing, Prototyping
Functional Area: Mechanical packaging design for LCD Based Display products and other electro mechanical products for Railways Applications
Desired Candidate Profile
Independently carry out the mechanical Design work for the Railway grade Display products such as DDU, HMI and & products such RMS, PAPIS, PIS, TCMS and other similar products under New Product Development projects.
Foresee the Structural and Thermal Design Risks and be a guide for Electronics Hardware packaging design verification to meet given Form, Fit and Functional requirements.
Guide and be a part of team for EMI EMC management related to mechanical packaging design
Guide and influence decisions in design of packaging and enclosures for electronic assemblies considering DFMA, thermal and structural integrity best practices.
Create requisite documentation related to Mechanical product design.
Coordinate all technical and project management work related to Mechanical design with cross functional team for the assigned project
Independently carry out Or Coordinate out-sourcing work of the part fabrication, Design Verification Analysis (Structural +Thermal Analysis)
Mechanical part – M parts /Plastic Parts vendor development/ interface with the vendor with sufficient knowledge of CNC milling, CNC bending, CNC laser cutting, Plastic injection molding etc for interaction with the vendors
Design of Assembly & Test Fixtures
Design of sheet metal, die casting components and rapid Prototyping components
Skills
Ability to handle the project work completely and independently from requirements capturing, analysis and design to taking the project through the stage review process till the validation of the design.
Have Hands-on skills on Solid Works (3D Modelling) for complex Electronics equipment’s, AutoCAD, Pro-E
Knowledge of electrical components placement on PCB with considerations for weight, vibration & shock , EMI etc
Have good knowledge & Hands-on skills on Structural (Nastran) & Thermal (Flowtherm /CFDesign) analysis software.
Have fundamental knowledge (inputs, boundary conditions etc) of Thermal and structural Analysis requirements from product and process point of view.
Have good knowledge of mechanical design techniques like GD&T and Tolerance stack up.
Knowledge on processes like riveting, welding etc
Knowledge of IP65 & IP54 and HL-2 & 3 compliant mechanical packaging design & practices.
Knowledge and hands on skills for Design for Manufacturability & Design for Assembly
Knowledge of DTC (Design to cost) best practices
Possess sufficient knowledge of detail drawing/document creation and drafting practices.
Knowledge of surface finish paints/.coatings- Anodization, Chromatization as per applicable IEC & EN standards
Experience in designing Mechanical sub-systems/systems and preferably Railways Electronics packaging.
Experience of working on Structural and Thermal analysis of Electronics boards and equipment’s including interpretation of the results from the analysis to take the decision for design modifications.
Experience of IEC & EN related environmental test requirements like Vibration, Shock, temperature etc and the ability to translate the requirements to Design verification parameters.
Exposure in Mechanical design aspects of Electronics components design likedesign of Heat sinks, Vibration isolation, Manufacturing processes and should understand the thermal effects of Electrical/Electronic components placement on PCB with considerations to effective thermal management, vibration, EMI/EMC etc
Other Attributes
Good analytical and problem solving skills
Compatibility so as to easily integrate in a Cross functional team
Curiosity and eagerness to learn new technologies
Be a team player, have the right attitude and be willing to work in challenging environment
Sensitivity to “Cost”
Sensitivity to “Time to Market”