Principal RF Design Engineer
2 months ago
Stream - Customer Focused Product Development for Mobility, Industrial, Energy & Telecom
Reporting To - Chief Development Officer / Global Head of Engineering
Location -Bengaluru
COMPANY DESCRIPTION
L&T Semiconductor Technologies (LTSCT), a fully owned subsidiary of L&T, is the first major Indian Semiconductor product company a fabless company for designing & delivering Smart Devices for Global Customers. A company that provides Semiconductor Devices and Technology partnerships by helping customers realise energy efficient, high performance systems to benefit from data, electrification and software defined technology trends.
Harnessing the engineering mastery of L&T, LTSCT is forging a path to a worldclass semiconductor ecosystem rooted in India. We aim to rewrite the rules of cutting-edge technology through relentless innovation to foster a vibrant culture of ingenuity, fuelling progress on every chip.
We have a presence in four prominent geographies i.e. US, Europe, Japan and India, with offices in Austin, Munich, London, Tokyo, Bangalore and Chennai.
JOB DESCRIPTION
LTSCT’s Chief Development Organization and Global Engineering team is a central engineering organization responsible for developing and delivering Systems-on-a-Chip (SoCs) for LTSCT's Automotive, Industrial, Energy and Telecom infra business lines. The team is challenged to produce industry leading solutions covering very cost sensitive, low power devices to highly integrated, high performance, multidomain devices compliant with the latest automotive and industrial safety and security standards.
AREAS OF RESPONSIBILITY:
Participate in the development of innovative RF and micro/mm-wave circuit designs, pushing the performance of the SiGe/CMOS transistors and passive devices to their limit to maximize the RF IC performance.
Bring ideas for RF circuit design concepts, perform initial RF simulations to select optimal design concepts for given circuit block(s).
Circuit design and design implementation to meet the block specification requirements.
Give guidance to other design and layout engineers on block interaction to optimize overall system performance
Responsible for design simulations to validate product performance using design kit models
Participate in design reviews and reporting
Qualifications
At least 10+years of experience in RF IC design, with significant experience in RF power amplifier (PA) design and/or LNA design.
Experience in optimizing (passive) matching networks in combination with switches.
Experience with relevant CAD tools (Cadence and ADS) and IC design methodology
Knowledge of modelling thermal behavior of designs: die-package-PCB
Experience with modelling metal RF structures and interconnect using EM tools: die -package - PCB
Good understanding of semiconductor physics
Structured IC design methodology covering specification, implementation, design and test
Driven to achieve success and able to participate in a team of expert engineers to reach clear design goal.
Able to drive technical decisions in a team based on facts and data in order to meet customer committed timelines.
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