Printed Circuit Board Design Engineer

1 day ago

Jaipur, India TechShlok, Electronics Design House Full time

PCB Design Engineer Techshlok, Electronics design house started in 2015 to accelerate innovators' journey through electronics engineering solutions. We have helped startups and corporates in building India's first-of-its-kind products now used by Fortune 500 companies, hospitals, malls & industries.

TechShlok is expanding its design team and looking to add a PCB design Engineer to the RnD unit to accelerate the development across multiple projects.

Experience:
3 to 5 years in PCB designing

Roles & Responsibilities:

PCB Layout & Design:

  • Perform end-to-end PCB layout, including component placement, routing, and generating manufacturing files.
  • Design multi-layer boards (4 layers and above) with adherence to industry standards, signal integrity, and EMI/EMC best practices.
  • Ensure optimal routing of high-speed signals (e.g., DDR, PCIe, USB, high-speed LVDS) and differential pairs.

Documentation & Collaboration:

  • Generate comprehensive documentation, including Gerber files, assembly drawings, and BOMs.
  • Collaborate closely with cross-functional teams (electrical, mechanical, and test engineers) to align design requirements and constraints.
  • Communicate with fabrication and assembly vendors to address DFM (Design for Manufacturability) and DFT (Design for Test) issues.

Quality & Optimization:

  • Conduct design reviews and participate in iterative layout improvements.
  • Optimize designs for signal integrity, power integrity, and thermal performance.
  • Implement proper grounding, shielding, and isolation strategies to ensure reliable system performance.

Must have skills:

  • Education
    : Bachelor's degree in Electronics Engineering or related field.
  • Tools: Kicad, Eagle or Altium
  • Knowledge:
    Strong understanding of PCB stack-up design, impedance control, and high-speed routing constraints.
  • Standards:
    Familiarity with IPC standards and best practices for PCB fabrication and assembly.
  • Communication:
    Excellent written and verbal communication skills, with the ability to collaborate effectively in a cross-functional team setting.

Good to have skills:

  • Experience working with various PCB materials and advanced technologies (HDI, blind/buried vias).
  • Familiarity with power distribution network analysis and thermal management techniques.
  • Exposure to simulation tools for signal integrity and EMI/EMC considerations.

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