Thermal Design Engineer

7 days ago

bangalore, India Tejas Networks Full time

About Tejas Networks :

Tejas Networks is an R&D-driven organization focused on being at the forefront of technological advancements in the field of telecommunications. With an R&D team comprising of more than 50% of the organization strength, we have continued to invest in the development of new product capabilities. Our products include carrier-grade optical transmission (based on DWDM/PTN/OTN technologies), fiber broadband (based on GPON/NG-PON), broadband wireless (based on Wireless 4G/5G) as well as multi-gigabit Ethernet/IP switching and routing products that are fully designed and manufactured in India…a true pioneer of “Make in India” initiative.


Tejas is one of the leading innovators in India’s ICT sector with over 349 patents and a large repository of 280+ semiconductor IPs. Tejas is actively contributing to global 5G standards through its work in India’s telecom standards organization (TSDSI). All this has been done with an energetic & dedicated team of engineers, for whom no problem is unsolvable.



Responsibilities:

Thermal Design Engineer: The selected eligible Engineer for this role will be responsible for complete thermal management of Telecom products, which includes, design, simulation/analysis, testing, validation and documentation. This role involves working within a multi-disciplinary team including Project Leaders, Mechanical design engineers, Electrical Engineers, Hardware Design Engineers and SCM team during the course of product development.


Job Description and Minimum Skills Required:

  • Candidate should have good understanding of fluid dynamics & Heat transfer fundamentals
  • Strong analytical and problem-solving skills with ability to work independently as well as in teams. Should be able to perform root cause analyses to debug system and sub-system level performance issues (thermal and mechanical related).
  • Experience in thermal testing of electronic systems for NEBS, GR-63-CORE, ETSI.
  • Must have sound working knowledge of practical thermal testing methods
  • Candidate should have prior experience of thermal testing on wireline and wireless telecom products (e.g., OLTs, ONTs, RRH, BBUs, Switches etc.)
  • Candidate should be enthusiastic to explore and develop new test methodology
  • Experience in providing thermal management solutions for the above-mentioned telecom products – for both natural and forced convection applications.
  • Candidate should be keen to explore and develop advanced cooling solutions using technologies like heat pipes, vapour chambers
  • Hands-on experience in using CFD tools like FloTherm / Flowsim (Solidworks), to carry out thermal simulations/analyses
  • Experience in correlating thermal simulation results with test results.
  • Proven experience in dealing with Heat sink design (heat pipe, vapor chamber), Fan selection, Thermal interface material selection and application
  • Hands-on experience in using mechanical design tool Solidworks
  • Experience in generating CAD models of heat sinks, thermal interface materials and coordinate with vendors to address manufacturability, cost, reliability, quality
  • Candidate should be ready to travel to vendors’ location or to address field issues as and when job demands
  • The selected candidate is expected to have strong documentation skills, and should bring a disciplined and thorough approach to assignments, including preparing well-organized thermal test reports, simulation reports and presentations using MS Office tools. Excellent oral, written and graphic communication skills


  • Qualification : BE / B. Tech / M. Tech in Mechanical Engineering with aspiration in Thermal Engineering



Experience: Minimum 6 to 8 Years

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