Failure Analysis Engineer

4 weeks ago

bangalore, India Tata Electronics Pvt. Ltd. Full time
Job Description: Failure Analysis Engineer
We are seeking an experienced Failure Analysis Engineer to join our team. The successful candidate will play a crucial role in providing comprehensive and timely failure analysis, constructional analysis, and technical services to both internal and external customers. As part of this role, you’ll utilize advanced failure analysis analytical tools to investigate and resolve issues related to printed circuit board assemblies (PCBAs), Integrated Circuits (ICs) and electronics components.
Key Responsibilities:
Failure Analysis: Investigate and analyze parts that have been reported as defective by customers or identified as rejects during in-house quality control.
IC, PCBA and electronics component Analysis: Conduct failure analysis on integrated circuits (ICs), PCBAs and electronics components after system integration and in response to field failure complaints.
Debugging and Continuous Improvement: Debug issues and provide continuous improvement solutions to enhance product quality and reliability.
Analytical Techniques: Utilize a range of failure analysis techniques, including X-Ray, CSAM (C-Mode Scanning Acoustic Microscopy), cross-sectional analysis, chemical decapsulation, laser decapsulation, optical inspection, IR (Infrared) inspection, SEM (Scanning Electron Microscopy) with EDX (Energy Dispersive X-ray Spectroscopy), ion chromatography, surface profilometer, strain testing, dye-penetrant testing, FTIR (Fourier Transform Infrared Spectroscopy), FIB (Focused Ion Beam), ESCA (Electron Spectroscopy for Chemical Analysis) or XPS (X-Ray Photo Spectroscopy), DSC (Differential Scanning Calorimetry), TMA (Thermomechanical Analysis), TG (Thermogravimetry), DTA (Differential Thermal Analysis), DMA (Dynamic Mechanical Analysis), etc.
Root Cause Identification: Identify root causes of hardware failures and propose effective workarounds for issue resolution.
Problem-Solving Methodology: Apply the 8D problem-solving methodology to systematically identify and address issues.
Capacity Enhancement: Continuously plan and improve the failure analysis capability and capacity.
Material, Process, and Design Recommendations: Provide failure analysis insights and recommendations related to material selection, manufacturing processes, and design aspects.
Quality Control Documentation: Develop and maintain quality control documentation, ensuring it remains up-to-date and accessible as needed.
Requirements:
Education: Bachelor’s or master’s degree in materials engineering, metallurgical engineering, chemistry, or a related field.
Experience: At least 3 years of hands-on experience in Failure Analysis within the IC & PCBA industry or electronics manufacturing environment.
Quality Knowledge: Strong understanding of quality control procedures and industry standards.
Communication Skills: Excellent verbal and written communication skills.
Analytical Aptitude: Proficient in analytical techniques and problem-solving.
Collaboration: Ability to work both independently and collaboratively as part of a team.

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