Package Engineer

1 month ago


Greater Bengaluru Area, India HCLTech Full time

IC Package Design Engineer

Job Location: Bangalore

Exp : 5 to 10 years


  • IC Package Design, Substrate Design with Flip Chip and Wire bonds.
  • Experience with IC Package Design using Mentor Graphics XPD, XSI tools and Cadence and Allegro APD.
  • Good understanding of package/substrate design and package assembly rules related to flip chip and wire bond designs.
  • Exposure to different package technologies such as MCM, SIP, SOC, 3D, 2.5D etc., added advantage.
  • Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR x, GDDR and HSIO interfaces including PCIe GenX, SERDES.
  • Good Exposure to Stackup design, DFM, DFA rules and adherence.
  • Should possess good knowledge and codesign work experience on SI, PI, Mechanical and Thermal analysis.
  • Expertise in High-Speed Complex PCB designs with HDI, Blind and Buried Via technologies.
  • Should have expertise in constraint setting in layout tool.
  • IC Package design/Substrate design experience is mandatory.
  • Should be able to work with customer SPOC independently.
  • Should have experience in all phases of Substrate and PCB design (from net-in to Gerber generation).


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