Package Engineer

4 weeks ago


Bengaluru, India HCLTech Full time
IC Package Design EngineerJob Location: BangaloreExp : 5 to 10 years

IC Package Design, Substrate Design with Flip Chip and Wire bonds.Experience with IC Package Design using Mentor Graphics XPD, XSI tools and Cadence and Allegro APD.Good understanding of package/substrate design and package assembly rules related to flip chip and wire bond designs.Exposure to different package technologies such as MCM, SIP, SOC, 3D, 2.5D etc., added advantage.Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR x, GDDR and HSIO interfaces including PCIe GenX, SERDES.Good Exposure to Stackup design, DFM, DFA rules and adherence.Should possess good knowledge and codesign work experience on SI, PI, Mechanical and Thermal analysis.Expertise in High-Speed Complex PCB designs with HDI, Blind and Buried Via technologies.Should have expertise in constraint setting in layout tool.IC Package design/Substrate design experience is mandatory.Should be able to work with customer SPOC independently.Should have experience in all phases of Substrate and PCB design (from net-in to Gerber generation).


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