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Failure Analysis Engineer
2 months ago
Mandatory : Electronic circuit analysis in analysing board/component/Field failures, Failure analysis, should be part of PCB manufacturing where they are looking for analysis of components and failed boards.
Good To Have : Reliability , Reliability growth & demonstration testing would be an added advantage. Job Description Summary
The Lead Engineer shall execute Failure Investigations of components, electronic board. work with lab technicians and cross functional teams to prepare failure flow and to rectify the failures. The individual shall also be responsible for verification and resolution by working with several cross functional teams for reliability flow , test requirements as per JEDEC standards.
Job Description
Roles and Responsibilities
- Responsible for leading and performing Analyses of Industrial electronics product failures.
- Responsible for developing strategies and implement adequate methods in the Lab for Failure Analyses and Tear down.
- Responsible for standardizing FA techniques to faster analysis.
- Responsible for Synergize FA activities by working with global teams as needed.
- Responsible in leading FA technicians on Elemental & Metallurgical Analyses, Non-Destructive Analyses, Thermal Analyses, Physical & Mechanical Analyses of Electronic components.
- Responsible for improving FA lab capabilities in 4M aspects
- Responsible for participating and demonstrating Failure Analysis capabilities to customers.
- Prepare analytical reports and present them to customers.
- Document new failure analysis operating procedures, training and certification specs.
- Perform routine instrument and strategies.
- Support RCA’s
- Apply Health & Safety practices at Workplace.
- Must be able to perform FA study individually and work well in teams.
Qualifications/Requirements
- Bachelor / Master in Electronics, Electronics & communication Engineering or equivalent. 8 + years of experience in failure analysis role.
- Certificate-NSQF (Level-4 in semiconductor domain)
- Experience with Thermal/OBIRCH/PEM
- Experience in other FA techniques including: Sample preparation ( IC delayering, decapsulation), X-Ray and basic circuit understanding would be a preferred.
- Experience with electronic circuit analysis
- Experience in electronics product Reliability , Reliability growth & demonstration testing would be an added advantage
