Process Quality Engineer

3 weeks ago

Assam India, India Tata Electronics Full time

Location: TATA Semiconductor Assembly and Test, Jagiroad, India


Position Overview:

As a Process Engineer in an OSAT environment, you will play a pivotal role in developing, optimizing, and sustaining semiconductor packaging processes. You will be responsible for wire bonding, flip chip assembly, and integrated system packaging technologies, supporting both high-volume production and new product introductions (NPI). This role demands a strong technical foundation, hands-on experience with packaging equipment, and the ability to collaborate across cross-functional teams including R&D, quality, and customer engineering.

Key Responsibilities:

1. Process Development & Optimization

  • Design and implement robust packaging processes including:
  • Wire bonding (ball/wedge bonding, fine pitch, multi-row)
  • Flip chip (underfill, reflow, thermal compression bonding)
  • Integrated system packaging
  • Conduct DOE (Design of Experiments) to optimize process parameters for yield, reliability, and throughput.
  • Develop and maintain process documentation: SOPs, control plans, FMEAs, build sheets etc.

2. Manufacturing Support

  • Provide real-time support to production lines to resolve process-related issues.
  • Monitor process KPIs such as yield, cycle time, defect rates, and equipment uptime.
  • Lead root cause analysis and implement corrective actions for maverick lots and customer returns.

3. New Product Introduction (NPI)

  • Collaborate with customer engineering and R&D teams to transfer new products from prototype to mass production.
  • Define tooling and equipment requirements for new packages.
  • Execute qualification plans including reliability testing.

4. Equipment & Tooling Management

  • Work with equipment vendors to install, calibrate, and maintain packaging tools (e.g., wire bonders, flip chip bonder, molding machines, etc.).
  • Drive automation and process standardization across multiple product lines.

5. Quality & Compliance

  • Ensure compliance with customer-specific requirements, JEDEC standards, and internal quality systems.
  • Support internal and external audits (ISO, customer audits, etc..).
  • Implement SPC and GR&R to monitor and control process stability.

Qualifications:

  • Bachelor’s or Master’s degree in Electronics, Mechanical, Materials Science, or related field.
  • 5–10 years of experience in semiconductor packaging, preferably in an OSAT environment.
  • Hands-on experience with wire bonding, flip chip, and SiP technologies.
  • Proficiency in statistical tools (Minitab, JMP), SPC, and Six Sigma methodologies.
  • Strong analytical and problem-solving skills.
  • Excellent communication skills; ability to work in a multicultural, fast-paced environment.

Preferred Skills:

  • Experience with QFN, BGA, WLCSP, and other packages.
  • Familiarity with substrate design, thermal modeling, and mechanical stress analysis.
  • Knowledge of cleanroom protocols, ESD handling.

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