IC Package Layout Design

2 hours ago


Greater Bengaluru Area, IN HCLTech Full time

Job Location: Bengaluru

Exp: 6 to 13 years

Notice Period: Immediate to 30 Days Only

Qualification: BE/BTech/ME/MTech/MS - Electricals & Electronics Engineering


Roles & Responsibilities:


  • IC Package Layout Design Engineer
  • Experience with IC Package Layout Design using Cadence Allegro APD (will consider Mentor Graphics XPD, XSI tools experience also)
  • Good understanding of package/substrate design and package assembly rules related to flip chip designs.
  • Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage.
  • Expertise in High-Speed Complex PCB and Package designs with HDI, Blind and Buried Via technologies.
  • Hands-on expertise with PCB and Package layout designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES and Type C.
  • Good Exposure to Stackup design, substrate DFM, DFA rules and adherence.
  • Should have expertise in constraint setting in layout tool.



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