Wire Bonding Equipment Engineer

2 weeks ago

Bengaluru, Karnataka, India GEECI Full time

GEECI is seeking an ambitious, highly skilled, and enthusiastic Wire Bonding Equipment Engineer with more than 2-5 years of experience in handling Wire Bonding equipment and processes in a Semiconductor/Electronics-related field.

The candidate should be able to independently troubleshoot problems; must be self-motivated, creative, and knowledgeable; and must be able to train others.

As a Wire Bonding Equipment Engineer, your responsibilities will include the following:

  • Operation of Wire bonders like Hesse, K&S, ASM, and TPT
  • Implementation of wire bonding process flows
  • Understanding all equipment process parameters to perform setups required by each product cycle
  • Training operators to handle equipment
  • Performing preventive maintenance of equipment

Skills required:

  • Excellent verbal and written communication
  • Highly organized, self-motivated, and disciplined
  • Ability to work with engineers across multiple disciplines as well as various suppliers
  • Prior training by an equipment vendor will be an added advantage

Requirements Minimum Qualification:
B.E. / B.Tech. / Diploma in fields, such as Electrical and Electronic Engineering, Electronics and Communications Engineering, Electronics Engineering, Mechanical Engineering, Industrial Engineering, Manufacturing Engineering

2-5 years of relevant experience

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