Senior SOC Physical Design Engineers

4 weeks ago

Bengaluru, India Samsung Semiconductor Full time

Samsung Semiconductors:

About Us – With a wide range of industry-leading semiconductor solutions, we are enabling innovative growth in markets segments from hyper scale data centres and automotive to IoT, mobile and consumer electronics. We develop software for Samsung's technology solutions across different products and our engineers are involved in many of Samsung’s strategic and important projects. SSIR is the largest R&D centre outside Korea for Samsung Electronics and we take pride in our ability to work on some of the cutting edge technologies that our parent organization ventures into. Our engineers get to work across diverse domains, projects, products, clients, people and countries, and conduct research in new and emerging areas of technology. Innovation and creativity are highly valued at SSIR as we strive towards providing high reliability; high performance and value added services that enable Samsung Electronics deliver excellent products. Samsung places great emphasis on the creation and protection of Intellectual Property.


Complex SOC Top Physical Implementation for next generation SoCs in area of mobile application processors, modem sub-systems and connectivity chips

by means of Synthesis , Place and Route, STA , timing and physical signoffs


- Hands on experience doing physical design and timing closure of complex blocks and full-chip designs

- Should have strong understanding of timing, power and area trade-offs and optimization of PPA

- Power user of industry standard tools (ICC/DC/PT/VSLP/Redhawk/Calibre/Formality) and able to understand their capabilities

- Should have solid understanding of scripting languages such as Perl/Tcl and implementation flows

- Experience with large SOC designs (>20M gates) with frequencies in excess of 1GHZ .

- Expertise in block level and full-chip SDC cleanup, Synthesis optimization , Low Power checking and logic equivalence checking

- Familiar with deep sub-micron designs (8nm/5nm) and associated issues (manufacturability, power, signal integrity, scaling)

- Familiar with typical SoC issues such as multiple voltage and clock domains, ESD strategies, mixed signal block integration, and package interactions.

- Familiar in hierarchical design, top-down design, budgeting, timing and physical convergence

- Experience in top level floorplanning including partition shaping and sizing, pin placement, channel planning,

high speed signal and clock planning and feed-through planning is a plus

- Good understanding of Physical Design Verification methodology to debug LVS/DRC issues at chip/block level

- Should have gone through 4+ recent successful SoC tape-outs

- Should have 8 ~ 14 years of experience in physical implemenation and design

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