Packaging Engineer

Job Title: Mechanical Engineer (Packages)Job purpose:The Mechanical engineer responsibilities comprise preparation of specification, TechnicalDatasheets, Requisitions for Quotation, Technical queries, Technical Bid Analysis, PurchaseRequisitions, and review of Vendor document/drawings for packages as per projectrequirements.Educational or experience...

Bosch Global Software Technologies Private Limited is a 100% owned subsidiary of Robert Bosch Gmb H, one of the world's leading global supplier of technology and services, offering end-to-end Engineering, IT and Business Solutions. With over 28,200+ associates, it’s the largest software development center of Bosch, outside Germany, indicating that it is...

Dear Candidate Greetings from TCS !!! Role: Application Packaging Engineer Location: Bangalore Experience Range: 7 to 12 Years Job Description: IT experience in managing and maintaining Microsoft Windows environments using enterprise systems management tools such as SCCM, Intune. Experience in deploying Windows 10/11 across an...

IIP Graduates -Mandatory and Immediate JoinersExperience: 2 to 3 yearsRequired skills and qualifications:• Minimum BS degree in Packaging Science or Engineering.• Excellent communication skills (written and verbal) in English.• Experience in cosmetic/beauty industry.• The successful candidate will be expected to work US Eastern Standard Time for 40...

Job Location: Bangalore Experience: 6-10 years Experience with IC Package Design using Allegro Package Designer (APD), IC Package Design experience. Good understanding of package/substrate design and package assembly rules related to flip chip designs. Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc.,...

Bosch Global Software Technologies Private Limited is a 100% owned subsidiary of Robert Bosch GmbH, one of the world's leading global supplier of technology and services, offering end-to-end Engineering, IT and Business Solutions. With over 28,200+ associates, it’s the largest software development center of Bosch, outside Germany, indicating that it is...

Dear CandidateGreetings from TCS !!!Role: Application Packaging EngineerLocation: BangaloreExperience Range: 7 to 12 YearsJob Description:IT experience in managing and maintaining Microsoft Windows environments using enterprise systems management tools such as SCCM, Intune.Experience in deploying Windows 10/11 across an enterprise.Application Distribution...

Job Title: Mechanical Lead Engineer Job Purpose: Technically responsible for engineering and procurement assistance of mechanical equipment / Packages for Offshore Platforms and FPSOs, in terms of compliance to project requirements. Educational or experience requirements: M.E /B. E (Mechanical) with minimum 15 - 20 years of experience in relevant...

Job Title: Mechanical Lead EngineerJob Purpose:Technically responsible for engineering and procurement assistance of mechanical equipment /Packages for Offshore Platforms and FPSOs, in terms of compliance to project requirements.Educational or experience requirements:M.E /B. E (Mechanical) with minimum 15 - 20 years of experience in relevant...

Bosch Global Software Technologies Private Limited is a 100% owned subsidiary of Robert Bosch GmbH, one of the world's leading global supplier of technology and services, offering end-to-end Engineering, IT and Business Solutions. With over 28,200+ associates, it’s the largest software development center of Bosch, outside Germany, indicating that it is...

Bosch Global Software Technologies Private Limited is a 100% owned subsidiary of Robert Bosch GmbH, one of the world's leading global supplier of technology and services, offering end-to-end Engineering, IT and Business Solutions. With over 28,200+ associates, it’s the largest software development center of Bosch, outside Germany, indicating that it is the...

Dear Candidate Greetings from TCS !!! Role: Application Packaging Engineer Location: Bangalore Experience Range: 7 to 12 Years Job Description: IT experience in managing and maintaining Microsoft Windows environments using enterprise systems management tools such as SCCM, Intune. Experience in deploying Windows 10/11 across an enterprise. Application...

Dear CandidateGreetings from TCS !!!Role: Application Packaging Engineer Location: BangaloreExperience Range: 7 to 12 YearsJob Description:IT experience in managing and maintaining Microsoft Windows environments using enterprise systems management tools such as SCCM, Intune.Experience in deploying Windows 10/11 across an enterprise.Application Distribution...

Job Title: Mechanical Engineer (Packages) Job purpose: The Mechanical engineer responsibilities comprise preparation of specification, Technical Datasheets, Requisitions for Quotation, Technical queries, Technical Bid Analysis, Purchase Requisitions, and review of Vendor document/drawings for packages as per project requirements. Educational or experience...

Job Title: Mechanical Engineer (Packages)Job purpose:The Mechanical engineer responsibilities comprise preparation of specification, TechnicalDatasheets, Requisitions for Quotation, Technical queries, Technical Bid Analysis, PurchaseRequisitions, and review of Vendor document/drawings for packages as per projectrequirements.Educational or experience...

Job Description :We are seeking a highly skilled Android BSP Engineer to develop and integrate board support packages (BSP) for custom hardware platforms running Android. The ideal candidate will have experience in working with peripheral devices and be adept at building, debugging, and maintaining the low-level software stack to ensure seamless...

Application Packing/Desktop Support EngineerApplication packaging, Jamf, InTune, MDT6-8 yearsBangalorequirementsDevelop, maintain, and deploy system images for various operating systems (Windows, macOS, Linux).Create and manage software packages for deployment using tools such as SCCM, PDQ Deploy, or other packaging solutions.Collaborate with IT and...

Job Location: BangaloreExperience: 6-10 yearsExperience with IC Package Design using Allegro Package Designer (APD), IC Package Design experience. Good understanding of package/substrate design and package assembly rules related to flip chip designs. Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added...

Application Packing/Desktop Support Engineer Application packaging, Jamf, InTune, MDT 6-8 years Bangalore quirements Develop, maintain, and deploy system images for various operating systems (Windows, macOS, Linux). Create and manage software packages for deployment using tools such as SCCM, PDQ Deploy, or other packaging solutions. Collaborate with...

Application Packing/Desktop Support Engineer Application packaging, Jamf, InTune, MDT 6-8 years Bangalore quirements Develop, maintain, and deploy system images for various operating systems (Windows, macOS, Linux). Create and manage software packages for deployment using tools such as SCCM, PDQ Deploy, or other packaging solutions. Collaborate with...