Tata Electronics | Manufacturing
1 week ago
Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.
Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’
Job Title : Manufacturing and Operations
Job Location : Jagirod, Assam
Job Overview:
The Head of Manufacturing and Operations will oversee the construction, setup, and operational ramp-up of a Semiconductor Assembly and Test facility. This senior role requires in-depth technical expertise in semiconductor manufacturing, operational leadership, and strategic decision-making, combined with extensive experience in electronics. The individual will lead the entire lifecycle of facility construction, from design and build to operational readiness, and ensure the highest standards in assembly, testing, and packaging processes.
Key Responsibilities:
1. Facility Design and Construction Oversight:
Lead and oversee the construction and setup of a state-of-the-art OSAT facility.
Collaborate with architects, engineers, and contractors to ensure design and build align with semiconductor industry standards and regulatory requirements.
Ensure all cleanroom, equipment, and infrastructure requirements are met to support semiconductor packaging and testing.
2. Operations Management:
Develop and implement operational plans, procedures, and processes to ensure efficient, high-quality manufacturing and testing.
Oversee the installation and commissioning of advanced semiconductor assembly and testing equipment.
Ensure compliance with safety, environmental, and quality regulations, including ISO and EHS standards.
Lead continuous improvement initiatives to enhance operational performance, efficiency, and yield.
3. Team Leadership and Development:
Build and lead cross-functional teams including engineering, production, and quality assurance professionals.
Mentor and develop junior engineers and operational staff, fostering a culture of excellence and innovation.
Set performance objectives and monitor team performance to ensure productivity and operational goals are achieved.
4. Process Optimization and Innovation:
Drive the adoption of advanced manufacturing technologies and automation to improve throughput and yield.
Implement lean manufacturing principles and Six Sigma methodologies to minimize waste and improve efficiency.
Collaborate with R&D and engineering teams to enhance packaging technologies and ensure alignment with market demands.
5. Vendor and Stakeholder Management:
Manage relationships with equipment vendors, suppliers, and subcontractors to ensure timely delivery and installation of equipment.
Engage with customers, partners, and internal stakeholders to align manufacturing capabilities with business goals.
Ensure effective communication with executive leadership regarding progress, challenges, and strategic decisions.
6. Financial Management:
Develop and manage operational budgets, including capital expenditures for facility construction and equipment purchases.
Ensure cost-effective management of resources, materials, and manpower while maintaining high-quality output.
Conduct financial forecasting, cost analysis, and ROI assessments for continuous improvement initiatives.
7. Compliance and Quality Assurance:
Ensure compliance with industry standards, including JEDEC and SEMI standards.
Lead quality assurance teams to implement rigorous testing protocols and maintain industry-leading quality levels.
Oversee the creation of quality systems for defect management, failure analysis, and corrective action processes.
Qualifications:
Bachelor’s or Master’s degree in Electronics Engineering, Semiconductor Engineering, or a related field.
30+ years of experience in the semiconductor industry, with a strong focus on manufacturing, assembly, and testing.
Strong experience in semiconductor wafer manufacturing, IC Packaging Assembly process, Die–Attach, Wire bonding, Inspection, Coating, Testing, Process control, Yield Improvement, Output target reach, final Packing, Packaging equipment installation.
Experience in setup cleanroom Class 1, Class 10, Class 100, Class 1000, Class 10k and above.
Proven track record in the design, construction, and operation of OSAT facilities or semiconductor manufacturing plants.
Deep knowledge of semiconductor packaging, testing technologies, and electronics.
Expertise in lean manufacturing, Six Sigma, and other process optimization methodologies.
Strong leadership, team-building, and mentoring skills.
Experience managing large-scale construction projects and complex manufacturing operations.
Excellent communication and stakeholder management skills.
Preferred Skills:
PMP certification or similar project management qualification.
Expertise in advanced packaging technologies such as 2.5D/3D IC packaging, Flip-chip, or Wafer-level packaging.
Familiarity with automation technologies, AI-driven manufacturing, and Industry 4.0 practices.
Experience with international facility construction and operations, including working with global suppliers and partners.
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