Senior Director, Packaging

Senior SoC Director / Senior Principal Engineer About Omni Design Technologies Omni Design Technologies is a leading provider of high-performance, ultra-low power IP cores, from 28nm down through advanced FinFET nodes, which enable differentiated system-on-chip (SoC), in applications ranging from 5G, wireline and optical communications, LiDAR, radar, automotive networking, AI, image sensors, and the internet-of-things (IoT). Our data converter (ADC and DAC) IP cores range from 6-bit to 14-bit resolution and from a few MSPS to more than 100 GSPS sampling rates. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas, California with additional design centers in Fort Collins-Colorado, Bangalore-India, Hyderabad-India, Dublin-Ireland, Boston-Massachusetts. Engineering – Digital Circuit Design / SOC Development – Engineering / Full-time / Hybrid Omni Design is working on exciting solutions and chips for next generation automotive and space applications and looking for talented and capable engineers. The Director of digital and mixed-signal engineering will be responsible for development of mixed-signal SOC being developed at ODT and build the digital engineering team and will work Analog/RF engineering, FW engineering, verification, Systems Validation team, Operations, SOC Architects, and report to the VP / SVP of ASIC Engineering. Nice to have experience in Manage digital team, hire, and retain best talent Work with cross-functional project teams to define product specifications, system architecture, HW/SW partitioning, and execution plan Deliver chip architecture, design, integration, programming model, verification, and manage hand-off to backend Support Silicon and System Validation, support system integration, and production testing Proven track record of success in high-performance/high-volume semiconductor industry SoC, embedded CPU and bus architectures, networking, and control interfaces Communications / DSP algorithms and power / area efficient implementations Digital IC design, design for low power and high speed, design for test (DFT) System modeling, RTL coding, Lint / CDC checking, simulation, synthesis, power analysis, timing analysis in Cadence / Synopsys design environments Embedded systems FPGA emulation, lab debug and chip validation Project planning and execution, and performing design tradeoffs to achieve performance, power, die size, and schedule targets Self-motivated, excellent communication skills, and ability to excel and to provide leadership in a fast-paced environment Senior Management experience preferred Work with architecture, physical design, and design teams to lead the implementation of the digital architecture. Develop and refine specification of the micro-architecture for the digital architecture. Experience ~12-25+ years of experience in the area of RTL design and verification of silicon ~ At Least 3+ years experience in leading low-power mixed-Signal SOC design ~10+ years of experience with FPGA architecture specification and design (Altera or Xilinx) for high-speed serial protocols, including USB-SS, PCIe, SATA/SAS, DisplayPort ~ Experience in leading, specifying, and work with Analog/RF team in developing, verifying, and productizing SERDES, CDR, and PLL/DLL designs ~ Experience with USB 3.0, DisplayPort, PCIe, or SATA based silicon designs preferred ~ Strong foundation in SoC architecture, design, verification and physical implementation ~ Expertise in Verilog/System Verilog, C/C++/SystemC, UVM, Scripting languages like Perl/Python, etc. ~ Experience in startup environment Put the RTL for the Full chip together. Help develop any BIST Develop the RTL for the various state machines and interfaces Help with the FC simulations debug Help close the timing issues if any come up and work with the PD person to resolve any SI issues. Be a mentor and lead a team of Digital design engineers Work with Systems and Test engineering team to help validate the parts and release them to production We strongly believe that the pace of the ongoing hardware revolution will be greatly accelerated by Design’s IP cores and the rapidly emerging semiconductor embedded design business ecosystem. we have created an exciting environment with amazing talent across multiple disciplines. We like self-motivated individuals, we encourage initiative, we look for leadership qualities, we value teamwork, we like diversity, and we reward excellence. If you are interested in making an impact as part of a young, fast growing, cutting edge technology company, please reach out to us. We offer excellent compensation. Mining The Knowledge Community'