Multidisciplinary Packaging and SOC Engineering Specialist
4 days ago
We're shaping the future of integrated circuit design and implementation at Synopsys Inc.
The ideal candidate will possess a strong background in physical design and SOC development, with expertise in advanced packaging and multidie design implementation. Industry-leading silicon design tools are a must for this role.
Key responsibilities include working on cutting-edge designs that combine industry-standard interfaces such as HBM3/4, UCIe, 3DIO, and other high-speed IPs. The chosen candidate will also contribute to technological advancements in multi-die packaging, including CoWoS, InFO, 3DIC, and more.
This position requires excellent communication skills, enabling effective interaction with customers and partners. A flexible attitude is essential, as occasional travel and work on-site at customer premises may be necessary.
A Bachelor's or Master's degree in Electrical and/or Computer Engineering is required, along with at least five years of experience in physical design and SOC development.
Essential qualifications include knowledge of Synopsys EDA tools like 3DIC Compiler, IC Compiler II, or Fusion Compiler, as well as experience with backend implementation, simulation, and sign-off. Familiarity with CAD flows, tools, and design methodology development for backend tools is also crucial.
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